It is an advantage for the front-end process if the wafer is not yet super thin. This is because a thicker wafer is easier to handle when affixing the ICs. The Wafer Grinding is essential in the back-end process since ever thinner wafers are required by the semiconductor industry. For this process, the wafer is finely polished on the rear side and evenly thinned to 15 μm. The wafers must then be polished to be as smooth as glass so that defects produced during grinding can then be removed. The ACCRETECH Polish Grinder grinds and polishes in one device.