Laser Dicing Machine for Wafer until 300 mm

High throughput


Excellent results

Low operating costs
  • Visible light microscope
  • High dicing-speed
  • Maximum yield – no cutting loss, no chipping
  • Does not require water, needs 85% less power

Production and sales of ML300 series was finished.
(This affects the whole ML300 series: ML300,ML300 RM, ML300EX, ML300 EX FH, ML300EXWH, ML300EX FHWH, ML300Plus FH, ML300 Plus WH, ML300Plus FHWH, ML300Plus RM, ML300PlusX WH, ML300PlusX FHWH, ML300PlusX RM)