{"id":75258,"date":"2025-07-01T09:32:41","date_gmt":"2025-07-01T07:32:41","guid":{"rendered":"https:\/\/www.accretech.eu\/?page_id=75258"},"modified":"2025-10-21T09:49:49","modified_gmt":"2025-10-21T07:49:49","slug":"al3000","status":"publish","type":"page","link":"https:\/\/www.accretech.eu\/en\/products\/semiconductor\/wafer-dicing-machines\/al3000\/","title":{"rendered":"AL3000"},"content":{"rendered":"<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='standard-grid'  class='av-layout-grid-container av-1hgk9x0-0057d09b97bf9d7e8965ad19087890b1 entry-content-wrapper main_color av-flex-cells  container_wrap fullsize'  >\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc\">\n.flex_cell.av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc{\nvertical-align:top;\n}\n.responsive #top #wrap_all .flex_cell.av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc{\npadding:0px 20px 0px 0px !important;\n}\n<\/style>\n<div class='flex_cell av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc av-gridrow-cell av_one_half no_margin' ><div class='flex_cell_inner'><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1f8fjlw-a2907e867f6c512940184233a9c8e85b\">\n.flex_column.av-1f8fjlw-a2907e867f6c512940184233a9c8e85b{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div class='flex_column av-1f8fjlw-a2907e867f6c512940184233a9c8e85b av_one_full first no_margin flex_column_div av-zero-column-padding '     ><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1aylclw-f8fce829a75e12691e6abbbe5053efe9\">\n#top .flex_column.av-1aylclw-f8fce829a75e12691e6abbbe5053efe9{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n.flex_column.av-1aylclw-f8fce829a75e12691e6abbbe5053efe9{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n.responsive #top #wrap_all .flex_column.av-1aylclw-f8fce829a75e12691e6abbbe5053efe9{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n<\/style>\n<div class='flex_column av-1aylclw-f8fce829a75e12691e6abbbe5053efe9 av_one_full first no_margin flex_column_div av-zero-column-padding '     ><section  class='av_textblock_section av-19tksqs-90b1233d13a375b6377d6034addcb2fe'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h1><span style=\"color: #154194; font-size: 36px; font-family: frutiger;\">Fully Automatic UV Laser Dicing Machine<\/span><\/h1>\n<h2>AL3000 \u2013 For 300\u202fmm Semiconductor Wafers<\/h2>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-4fc6fo-f9f5e21ef77b7de2ad40f368cd8d9ad0'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><p>The AL3000 is a state-of-the-art, fully automatic UV laser dicing machine designed for the precise processing of 300\u202fmm semiconductor wafers. Developed for use in semiconductor manufacturing, it combines an innovative laser engine with an extremely stable machine platform to ensure high cutting quality and maximum productivity \u2013 even with sensitive materials such as low-k dielectrics or metal layers.<\/p>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-50edc9949d927eab467680f201044eec\">\n#top .hr.hr-invisible.av-av_hr-50edc9949d927eab467680f201044eec{\nheight:25px;\n}\n<\/style>\n<div  class='hr av-av_hr-50edc9949d927eab467680f201044eec hr-invisible'><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><\/p><\/div><div class='flex_column av-av_four_fifth-7714eba142aeda1f8b5272a3c372b279 av_four_fifth first flex_column_div '     ><p><div  class='avia-button-wrap av-mdsg3ls8-d9a86c6b6aab0348432f9834876ccc3b-wrap avia-button-left  new-home-button-big custom-icon'><a href='#kontaktformular'  class='avia-button av-mdsg3ls8-d9a86c6b6aab0348432f9834876ccc3b avia-icon_select-yes-left-icon avia-size-large avia-position-left avia-color-theme-color'  ><span class='avia_button_icon avia_button_icon_left' aria-hidden='true' data-av_icon='\ue805' data-av_iconfont='entypo-fontello'><\/span><span class='avia_iconbox_title' >Request more information about AL3000<\/span><\/a><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mdsg3wmf-19e49333cf5a2bf9a280acc4d2286c91\">\n#top .hr.hr-invisible.av-mdsg3wmf-19e49333cf5a2bf9a280acc4d2286c91{\nheight:25px;\n}\n<\/style>\n<div  class='hr av-mdsg3wmf-19e49333cf5a2bf9a280acc4d2286c91 hr-invisible'><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><\/p><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-y25qqs-1003e429124afb3d5b06c805d732b91d\">\n#top .flex_column.av-y25qqs-1003e429124afb3d5b06c805d732b91d{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n.flex_column.av-y25qqs-1003e429124afb3d5b06c805d732b91d{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n.responsive #top #wrap_all .flex_column.av-y25qqs-1003e429124afb3d5b06c805d732b91d{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n<\/style>\n<div class='flex_column av-y25qqs-1003e429124afb3d5b06c805d732b91d av_one_full first no_margin flex_column_div av-zero-column-padding '     ><section  class='av_textblock_section av-364qh0-6659eb4cddfe2339f7c268e54e770099'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Key Features<\/h3>\n<ul>\n<li><strong>Fully Automated Workflow<\/strong><br \/>\nIntegrated processes from the application of water-soluble protective films to laser dicing and cleaning \u2013 without manual intervention.<\/li>\n<li><strong>Optimized for Low-k Materials &amp; Metals<\/strong><br \/>\nUV laser technology allows gentle processing with minimal thermal stress and high precision.<\/li>\n<li><strong>High Throughput without Compromising Quality<\/strong><br \/>\nThe unique combination of laser control and stable mechanics eliminates the typical trade-off between quality and speed.<\/li>\n<li><strong>Intuitive Operation<\/strong><br \/>\n17-inch touch panel with user-friendly GUI \u2013 known from the AD\/SS series \u2013 for simple and efficient control.<\/li>\n<li><strong>Suitable for \u03a6300\u202fmm Wafers<\/strong><br \/>\nFlexible integration in modern production environments.<\/li>\n<\/ul>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-mdsgg8iv-663f649ceadeaeed671d7476f33604ea'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Typical Applications<\/h3>\n<ul>\n<li>Laser grooving for dicing-before-grinding processes<\/li>\n<li>Preparation of sensitive structures for plasma dicing<\/li>\n<li>Gentle processing in advanced packaging<\/li>\n<\/ul>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-mdsj1454-082131bd0d9a41a40682f6fac8f03c5a'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Technical Specifications \u2013 AL3000<\/h3>\n<ul>\n<li>Processing Method: Ablation (UV laser)<\/li>\n<li>Laser Source: Solid-state laser, UV (355\u202fnm), Q-switch<\/li>\n<li>Max. Wafer Size: \u03a6305\u202fmm<\/li>\n<li>Cutting Area (X \u00d7 Y): 310\u202fmm \u00d7 310\u202fmm<\/li>\n<li>Max. Speed (X-Axis): 1,000\u202fmm\/s<\/li>\n<li>Max. Speed (Y-Axis): 300\u202fmm\/s<\/li>\n<li>Positioning Accuracy: \u00b10.078\u202f\u00b5m<\/li>\n<li>Repeatability: \u00b11.0\u202f\u00b5m<\/li>\n<li>Max. Rotation Angle (\u03b8-Axis): 380\u00b0<\/li>\n<li>Power Supply: 3-phase 200\u2013220\u202fV (380\/415\u202fV optional)<\/li>\n<li>Power Consumption: approx. 2.0\u202fkVA<\/li>\n<li>Air Supply: 0.5\u20130.7\u202fMPa, \u00d8 400\u202fL\/min<\/li>\n<li>Nitrogen Supply: 0.3\u20130.5\u202fMPa, \u00d8 30\u202fL\/min<\/li>\n<li>DI Water Consumption (max.): 6.0\u202fL\/min at 0.3\u20130.5\u202fMPa<\/li>\n<li>Exhaust Volume: \u2265 4.0\u202fm\u00b3\/min<\/li>\n<li>Machine Dimensions (W \u00d7 D \u00d7 H): 1,645\u202fmm \u00d7 1,680\u202fmm \u00d7 1,800\u202fmm<\/li>\n<li>Weight: approx. 2,500\u202fkg&lt;(li&gt;<\/li>\n<li>A chiller and a dust separator are included as additional equipment.<\/li>\n<\/ul>\n<p>Get all the details on the AL3000 laser dicing machine and discover how our system can boost your production efficiency.<\/p>\n<\/div><\/section><\/p><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b\">\n#top .flex_column.av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n.flex_column.av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n.responsive #top #wrap_all .flex_column.av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n<\/style>\n<div class='flex_column av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b av_four_fifth first no_margin flex_column_div av-zero-column-padding '     ><section  class='av_textblock_section av-mh09jrc9-8f31fe9e462098a512c3a88c43cb4a4d'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Explore Our Full Product Line<\/h3>\n<p>Download the product overview to see how our solutions can support your needs.<\/p>\n<\/div><\/section><br \/>\n<div  class='avia-button-wrap av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4-wrap avia-button-left  new-home-button custom-icon'>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4\">\n#top #wrap_all .avia-button.av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4{\nbackground-color:#ffffff;\nborder-color:#ffffff;\ncolor:#154194;\n-webkit-transition:all 0.4s ease-in-out;\n-moz-transition:all 0.4s ease-in-out;\n-ms-transition:all 0.4s ease-in-out;\n-o-transition:all 0.4s ease-in-out;\ntransition:all 0.4s ease-in-out;\n}\n<\/style>\n<a href='https:\/\/go.semiconductor.accretech.eu\/product-guidebook-en'  class='avia-button av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4 avia-icon_select-yes-left-icon avia-size-large avia-position-left'  ><span class='avia_button_icon avia_button_icon_left' aria-hidden='true' data-av_icon='\ue82d' data-av_iconfont='entypo-fontello'><\/span><span 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