{"id":75263,"date":"2025-07-01T09:50:22","date_gmt":"2025-07-01T07:50:22","guid":{"rendered":"https:\/\/www.accretech.eu\/?page_id=75263"},"modified":"2025-10-21T09:51:09","modified_gmt":"2025-10-21T07:51:09","slug":"ml3200","status":"publish","type":"page","link":"https:\/\/www.accretech.eu\/en\/products\/semiconductor\/wafer-dicing-machines\/ml3200\/","title":{"rendered":"ML3200"},"content":{"rendered":"<\/div><\/div><\/div><!-- close content main div --><\/div><\/div><div id='standard-grid'  class='av-layout-grid-container av-1hgk9x0-0057d09b97bf9d7e8965ad19087890b1 entry-content-wrapper main_color av-flex-cells  container_wrap fullsize'  >\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc\">\n.flex_cell.av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc{\nvertical-align:top;\n}\n.responsive #top #wrap_all .flex_cell.av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc{\npadding:0px 20px 0px 0px !important;\n}\n<\/style>\n<div class='flex_cell av-1g8g1zo-c6bce1aeaafad2dee4f6e4f7267995fc av-gridrow-cell av_one_half no_margin' ><div class='flex_cell_inner'><p>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1f8fjlw-a2907e867f6c512940184233a9c8e85b\">\n.flex_column.av-1f8fjlw-a2907e867f6c512940184233a9c8e85b{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n<\/style>\n<div class='flex_column av-1f8fjlw-a2907e867f6c512940184233a9c8e85b av_one_full first no_margin flex_column_div av-zero-column-padding '     ><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-1aylclw-f8fce829a75e12691e6abbbe5053efe9\">\n#top .flex_column.av-1aylclw-f8fce829a75e12691e6abbbe5053efe9{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n.flex_column.av-1aylclw-f8fce829a75e12691e6abbbe5053efe9{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n.responsive #top #wrap_all .flex_column.av-1aylclw-f8fce829a75e12691e6abbbe5053efe9{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n<\/style>\n<div class='flex_column av-1aylclw-f8fce829a75e12691e6abbbe5053efe9 av_one_full first no_margin flex_column_div av-zero-column-padding '     ><section  class='av_textblock_section av-19tksqs-90b1233d13a375b6377d6034addcb2fe'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h1><span style=\"color: #154194; font-size: 36px; font-family: frutiger;\">Fully Automatic Laser Dicing Machine for \u03a6300\u202fmm Semiconductor Wafers<\/span><\/h1>\n<h2>ML3200 \u2013 Maximum Precision and Efficiency<\/h2>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-4fc6fo-f9f5e21ef77b7de2ad40f368cd8d9ad0'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><p>The ML3200 is the answer to the increasing demands in semiconductor manufacturing. As a fully automatic laser dicing machine with IR laser technology, it enables precise, fast, and contactless wafer processing \u2013 ideal for the latest MEMS devices and other sensitive semiconductor components. Our machine not only boosts your productivity but also helps significantly reduce costs by maximizing yield while minimizing resource consumption.<\/p>\n<\/div><\/section><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-50edc9949d927eab467680f201044eec\">\n#top .hr.hr-invisible.av-av_hr-50edc9949d927eab467680f201044eec{\nheight:25px;\n}\n<\/style>\n<div  class='hr av-av_hr-50edc9949d927eab467680f201044eec hr-invisible'><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><\/p><\/div><div class='flex_column av-av_four_fifth-7714eba142aeda1f8b5272a3c372b279 av_four_fifth first flex_column_div '     ><p><div  class='avia-button-wrap av-mdsg3ls8-7bbd3717c39e59b65ea9edcee413d67b-wrap avia-button-left  new-home-button-big custom-icon'><a href='#kontaktformular'  class='avia-button av-mdsg3ls8-7bbd3717c39e59b65ea9edcee413d67b avia-icon_select-yes-left-icon avia-size-large avia-position-left avia-color-theme-color'  ><span class='avia_button_icon avia_button_icon_left' aria-hidden='true' data-av_icon='\ue805' data-av_iconfont='entypo-fontello'><\/span><span class='avia_iconbox_title' >Request more information about ML3200<\/span><\/a><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mdsg3wmf-19e49333cf5a2bf9a280acc4d2286c91\">\n#top .hr.hr-invisible.av-mdsg3wmf-19e49333cf5a2bf9a280acc4d2286c91{\nheight:25px;\n}\n<\/style>\n<div  class='hr av-mdsg3wmf-19e49333cf5a2bf9a280acc4d2286c91 hr-invisible'><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><\/p><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-y25qqs-1003e429124afb3d5b06c805d732b91d\">\n#top .flex_column.av-y25qqs-1003e429124afb3d5b06c805d732b91d{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n.flex_column.av-y25qqs-1003e429124afb3d5b06c805d732b91d{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n.responsive #top #wrap_all .flex_column.av-y25qqs-1003e429124afb3d5b06c805d732b91d{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n<\/style>\n<div class='flex_column av-y25qqs-1003e429124afb3d5b06c805d732b91d av_one_full first no_margin flex_column_div av-zero-column-padding '     ><section  class='av_textblock_section av-364qh0-6659eb4cddfe2339f7c268e54e770099'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Key Benefits of the ML3200:<\/h3>\n<ul>\n<li><strong>Maximum Productivity with High Precision:<\/strong><br \/>\nWith processing speeds of up to 800\u202fmm\/s, the ML3200 enables ultra-fast wafer processing. Benefit from high throughput and consistent, reliable performance that optimizes your production lines.<\/li>\n<li><strong>Cost Reduction Through Higher Yields:<\/strong><br \/>\nThe ML3200 helps lower production costs by reducing the dicing street width, increasing chip yield by up to 20%. This yield improvement means more profitable chips per wafer and a faster return on investment.<\/li>\n<li><strong>Completely Dry \u2013 No Water, No Problem:<\/strong><br \/>\nThe dry process of the ML3200 is ideal for MEMS devices and other sensitive components that cannot tolerate water or moisture. Thanks to contactless dicing technology, your wafer surfaces remain undamaged.<\/li>\n<li><strong>Flexibility Through Versatile Options:<\/strong><br \/>\nWith numerous optional features, such as internal cleaning (Class 100) and wafer thickness measurement, the machine can be tailored precisely to your specific requirements. You get a customized solution that evolves with your production process.<\/li>\n<li><strong>Future-Proof Technology:<\/strong><br \/>\nWhether you&#8217;re processing ultra-thin wafers or standard wafers, the ML3200 adapts to different material thicknesses without compromising on quality.<\/li>\n<\/ul>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-mdsgg8iv-663f649ceadeaeed671d7476f33604ea'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Technical Highlights:<\/h3>\n<ul>\n<li>Maximum Wafer Size: \u03a6300\u202fmm<\/li>\n<li>Processing Speed (X-Axis): Up to 2,100\u202fmm\/s<\/li>\n<li>Positioning Accuracy: 0.002\u202fmm<\/li>\n<li>Process Types: LAG (Laser After Grinding) and GAL (Grinding After Laser)<\/li>\n<li>Dimensions: 1,712\u202fmm \u00d7 2,960\u202fmm \u00d7 1,800\u202fmm<\/li>\n<li>Weight: 3,000\u202fkg<\/li>\n<\/ul>\n<\/div><\/section><br \/>\n<section  class='av_textblock_section av-mdsj1454-082131bd0d9a41a40682f6fac8f03c5a'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Why the ML3200 Is the Perfect Choice for Your Production:<\/h3>\n<ul>\n<li>Higher yields mean more profitable chips with lower material costs<\/li>\n<li>Optimized speed results in faster production times and higher throughput<\/li>\n<li>Water-free operation protects sensitive components and lowers resource expenses<\/li>\n<li>Customizable with numerous optional features to optimize quality and productivity<\/li>\n<\/ul>\n<p>Learn more about how the ML3200 can boost efficiency in your manufacturing process.<\/p>\n<\/div><\/section><\/p><\/div>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b\">\n#top .flex_column.av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n.flex_column.av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b{\n-webkit-border-radius:0px 0px 0px 0px;\n-moz-border-radius:0px 0px 0px 0px;\nborder-radius:0px 0px 0px 0px;\npadding:0px 0px 0px 0px;\n}\n.responsive #top #wrap_all .flex_column.av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b{\nmargin-top:30px;\nmargin-bottom:0px;\n}\n<\/style>\n<div class='flex_column av-av_four_fifth-45205f022a3bb2ad5423f31a9950459b av_four_fifth first no_margin flex_column_div av-zero-column-padding '     ><section  class='av_textblock_section av-mh09lmkn-3dacf25e57bda504d576ddf981817a10'  itemscope=\"itemscope\" itemtype=\"https:\/\/schema.org\/CreativeWork\" ><div class='avia_textblock'  itemprop=\"text\" ><h3>Explore Our Full Product Line<\/h3>\n<p>Download the product overview to see how our solutions can support your needs.<\/p>\n<\/div><\/section><br \/>\n<div  class='avia-button-wrap av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4-wrap avia-button-left  new-home-button custom-icon'>\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4\">\n#top #wrap_all .avia-button.av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4{\nbackground-color:#ffffff;\nborder-color:#ffffff;\ncolor:#154194;\n-webkit-transition:all 0.4s ease-in-out;\n-moz-transition:all 0.4s ease-in-out;\n-ms-transition:all 0.4s ease-in-out;\n-o-transition:all 0.4s ease-in-out;\ntransition:all 0.4s ease-in-out;\n}\n<\/style>\n<a href='https:\/\/go.semiconductor.accretech.eu\/product-guidebook-en'  class='avia-button av-mdsggteq-4cf804b3aa9d66433856089a03d04ff4 avia-icon_select-yes-left-icon avia-size-large avia-position-left'  ><span class='avia_button_icon avia_button_icon_left' aria-hidden='true' data-av_icon='\ue82d' data-av_iconfont='entypo-fontello'><\/span><span class='avia_iconbox_title' >Download our Product Overview<\/span><\/a><\/div><br \/>\n\n<style type=\"text\/css\" data-created_by=\"avia_inline_auto\" id=\"style-css-av-av_hr-50edc9949d927eab467680f201044eec\">\n#top .hr.hr-invisible.av-av_hr-50edc9949d927eab467680f201044eec{\nheight:25px;\n}\n<\/style>\n<div  class='hr av-av_hr-50edc9949d927eab467680f201044eec hr-invisible'><span class='hr-inner '><span class=\"hr-inner-style\"><\/span><\/span><\/div><\/p><\/div><div class='flex_column av-av_four_fifth-7714eba142aeda1f8b5272a3c372b279 av_four_fifth first flex_column_div '     ><p><div  class='avia-button-wrap av-av_button-b4b8cdfaf5c9b204c879a45f2911aaee-wrap avia-button-left  new-home-button-big custom-icon'><a href='#kontaktformular'  class='avia-button av-av_button-b4b8cdfaf5c9b204c879a45f2911aaee avia-icon_select-yes-left-icon avia-size-large avia-position-left avia-color-theme-color'  ><span class='avia_button_icon avia_button_icon_left' aria-hidden='true' data-av_icon='\ue805' data-av_iconfont='entypo-fontello'><\/span><span class='avia_iconbox_title' 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