High-Precision Prober for Framed 300 mm Wafers and MEMS Applications
FP3000W
The FP3000W is a high-precision wafer probing system for 300 mm wafers on dicing frames. Designed for testing CSP, WLP, PLP devices, and MEMS components, this multifunctional prober model supports fully automated wafer transfer and testing on both wafers and frames with just one push of a button.
Thanks to its unique correction technology, the FP3000W enables micron-level measurements on diced wafers, packages, and other components mounted on the dicing frame. The correction optimization is based on over 15 years of experience with frame-transfer probers, ensuring exceptional precision and reliability.
Options and Features:
- 8/12″ Dual-Wafer Transfer Mechanism
- 8″ Frame Transfer Mechanism
- Multiple Barcode Management
- FFU for Clean Testing Environments
- Joint Manipulator for Test Heads
- High-Temperature Test Environment
- Ultra-High-Resolution Color Optical System
- Needle Trace Inspection
- PLP Testing for Up to 300 mm Square Wafers
Optimize your wafer testing with the FP3000W – contact us now for your customized solution!
