Wafer Prober

Wafer Probers are machines which are required for electrical testing of the wafers of individual chips. The Prober therefore undertakes the fully automatic loading and handling of the wafer while ensuring the best positioning accuracy. A full test cell consists of a wafer prober, a test unit and a probe card. Our flagship wafer probers for wafers of up to 200 mm or 300 mm diameter do not only work with the highest precision thanks to the latest technology, but also ensure maximum capacity and productivity with their above average and high throughput.

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≤ 200 mm Wafer Prober

The right solution for every requirement: from proven, fully automatic basic models to ultra-quick high end models with the highest precision in a large temperature range.
UF190R
 UF200R
 UF2000

≤ 300 mm Wafer Prober

Higher throughput and +-1,5 µm precision for wafers up to 300 mm diameter. It can be adapted to all testing environments and makes simple handling and navigation possible.
UF3000EX
 UF3000EX-e

Wafer and Frame Prober

Flexibility at a high level. The Frame Handling Prober can be used for both testing ultra-thin wafers and for wafers on the dicing frame.
 FP2000

 FP3000

Key Features

High Voltage

High Current

Vaccum-less handling (MEMS)

Light-free 

Group Index

Bump Probing

Color Camera

Super-high Magnification camera

Mini environment (ISO xx)

OHT

Thin Wafer

Ultra Thin Wafer

Top-side handling

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