Wafer Dicing – Blades
Dicing blades are saw blades which are used in fully and semi-automated blade dicing machines. The selection of the right kind of dicing blade is a prerequisite for good sawing quality, with high-precision cut edges. ACCRETECH precision dicing blades are available for a vast range of applications and wafer materials. Unique electroplating technology ensures even granulation distribution, and high stability. We also offer our customers dressing plates, in order to avoid clogging
For high speed and long service life
For high rigidity and low erosion
For sawing metal substrates
Blades with Synthetic Resin Bonds
Long service life, high speed, and improved process stability
With excellent properties for sawing ceramics and glass
Conditions the hub blade in a short time