Laser Dicing

With the new generation of wafers, wafer dicing machines with laser technology have a clear advantage. The ML lasers developed by ACCRETECH do not cut with blades, but contactlessly from the inside out with a laser beam. The laser is focused below the wafer surface and breaks up the crystalline structure. Afterwards, the wafer can be separated completely dry and dust-free with an expander. With 85% less power consumption and 100% less water consumption.

≤ 300 mm

High Performance Laser Dicing Maschines for wafer until 300 mm diameter