Grinding Machines – High Rigid Grinders
The High Rigid Grinder is particularly suitable for companies who use very hard materials such as SiC, Sapphire, Si, ALN or GaN for wafer production. With the HRG300/HRG300A, individual wafers with a larger diameter (300 mm or 450 mm) can be ground as well as whole wafer stacks with a smaller diameter. The high stability and lower vibrations significantly reduce the grinding time and increase the service life of the grinding stone. The system is complemented by an optional In-Process Dressing function and a device which automatically measures the thickness of the wafer during the grinding process.