HRG300 A

HRG300A

Fully automatic High Rigid Grinder for wafers up to 300 mm

For ultra-hard wafer materials

Highest Grinding Speed

In the process measurement of the wafer thickness

Automatic Dressing Function

Ideal for processing individual 300 mm wafers and batch grinding for wafers with a smaller diameter
High precision for extremely hard materials such as SiC, Sapphire, LiNb, Lithium Tantalate (TTV smaller than 0.5 µm/WTW thinner than +-1 µm)
High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
It extends the lifespan of the grinding stone
With an In-Process measuring instrument which is batch compatible and measures the wafer thickness during processing in piles
Inspects the clogging of the grindstone and performs dressing if required