Fully automatic High Rigid Grinder for wafers up to 300 mm

For ultra-hard wafer materials

Highest Grinding Speed

In the process measurement of the wafer thickness

Automatic Dressing Function
  • Ideal for processing individual 300 mm wafers and batch grinding for wafers with a smaller diameter
  • High precision for extremely hard materials such as SiC, Sapphire, LiNb, Lithium Tantalate (TTV smaller than 0.5 µm/WTW thinner than +-1 µm)
  • High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
  • It extends the lifespan of the grinding stone
  • With an In-Process measuring instrument which is batch compatible and measures the wafer thickness during processing in piles
  • Inspects the clogging of the grindstone and performs dressing if required

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