Grinder – High Rigid Grinder
The High Rigid Grinder is particularly suitable for companies who use very hard materials such as SiC, Sapphire, Si, ALN or GaN for wafer production. With the HRG300/HRG300A, individual wafers with large diameters (300 mm or 450 mm) can be ground as well as whole wafer stacks with smaller diameters. The grinding time has been significantly reduced and the lifetime of the grinding stone has been increased thanks to the high stability and lower vibrations. The system is complemented by an optional In-Process Dressing function and a device which automatically measures the thickness of the wafer during the grinding process.