HRG300

Semi-automatic High Rigid Grinder for wafers up to 300 mm

For ultra-hard wafer materials

Highest grinding speed

In the process measurement of the wafer thickness

Automatic Dressing Function

Ideal for processing individual 300 mm wafers and batch grinding for wafers with a small diameter
Also available for numerous special applications, such as MEMS wafer handling
High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
It extends the lifespan of the grinding stone
With the In-Process measuring instrument, which is also suitable for wafer processing in piles and which measures the wafer thickness during the procedure
Inspects the clogging of the grindstone and performs dressing if required