Semi-automatic High Rigid Grinder for wafers up to 300 mm

For ultra-hard wafer materials

Highest grinding speed

In the process measurement of the wafer thickness

Automatic Dressing Function
  • Ideal for processing individual 300 mm wafers and batch grinding for wafers with a small diameter
  • Also available for numerous special applications, such as MEMS wafer handling
  • High stability – for shorter preparation times, less grinding damage and individual, separate Self Sharpening Function
  • It extends the lifespan of the grinding stone
  • With the In-Process measuring instrument, which is also suitable for wafer processing in piles and which measures the wafer thickness during the procedure
  • Inspects the clogging of the grindstone and performs dressing if required

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