Polish Grinder for simultaneous thinning and defect removal of wafers up to 300 mm

Innovative Technologies

2 work steps in one

High Efficiency

Flawless Results
  • Grinder + CMP Stress Release
  • Higher throughput – for 15 µm wafer thinning in high volume production
  • The RM200/300 module (Wafer Mounter/Remounter) offers complementary PG200/300 Processing in one unit – it removes the protective tape from thinner wafers and applies the wafers to the dicing frames
  • Performs pre-grinding, fine grinding, polishing and cleaning of both sides of the wafer in the machine
  • All processes are carried out on the same chuck – the wafer does not need to be moved

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+49 (0)89 546788-0

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