ChaMP 211/232
High Performance CMP Technology for wafers up to 200mm
Optimum Interaction of all Components
Outstanding Results
Can be configured for high volumes
- Modular, flexible and compact design
- Dry in Dry Out with cleaning option
- Polishing head with Air Float Technology
- Easy Maintenance
- End Point Detection (EPD) for high precision and even polishing
- Processed Cu / STI/ ILD / SOI etc.
- For ChaMP 232, also with 3 polishing tables and 2 polishing heads – ideal for mass production
ChaMP 211 Layout
ChaMP 232 Layout