ChaMP 211/232

High Performance CMP Technology for wafers up to 200mm

Maximum Process Safety

Optimum Interaction of all Components

Outstanding Results

Can be configured for high volumes
  • Modular, flexible and compact design
  • Dry in Dry Out with cleaning option
  • Polishing head with Air Float Technology
  • Easy Maintenance
  • End Point Detection (EPD) for high precision and even polishing
  • Processed Cu / STI/ ILD / SOI etc.
  • For ChaMP 232, also with 3 polishing tables and 2 polishing heads – ideal for mass production

ChaMP 211 Layout

ChaMP 232 Layout