High-Performance CMP Systems for Wafers up to 200 mm
ChaMP 211 / 232
The ChaMP 211/232 series from Accretech offers precise and reliable CMP machines specifically designed to meet the requirements of 200 mm wafer manufacturing. Modular, compact, and flexible – ideal for process reliability and excellent surface quality.
Your Advantages at a Glance
- Maximum process reliability thanks to the optimal interaction of all components
- Modular and compact design for easy integration into your production line
- Polishing head with Air-Float technology for gentle and uniform polishing
- End Point Detection (EPD) for highly precise, reproducible polishing
- Dry-in/Dry-out process with cleaning option for contamination-free wafer transfer
- Easy maintenance thanks to well-thought-out system design
Who is the ChaMP 211/232 Series Suitable For?
- Semiconductor manufacturers with 200 mm wafer lines
- Production sites focused on process reliability and surface quality
- Development departments and foundries
Contact us to learn more about Accretech’s powerful CMP solutions.
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