Can CMP keep up with Advanced Packaging?

Modern CMP systems with smart and adaptive platforms support packaging innovation while achieving sustainability targets.

Becoming more sustainable and pushing boundaries of materials and formats

Chemical Mechanical Polishing (CMP) remains essential in backend semiconductor manufacturing as they are providing the planarity and material control needed for high-performance devices.
But as devices become more complex, CMP must evolve:

Modular, Flexible Platforms support multiple wafer sizes, panel formats, and materials with fast changeovers.
Integrated Automation and Data Systems stabilize performance and enable intelligent scheduling
Sustainability by Design optimizes energy efficiency, track resource usage and supports compliance with emerging environmental standards

Who should read this?

Process and integration engineers
Sustainability and facility managers
Operations leaders
Fab managers
For everyone who is interested in the topic

CMP becomes a strategic enabler for your advanced packaging!

Download the whitepaper!

Chemical Mechanical Polishing_WhitePaper_MockUp_ENG

Here you can download the white paper for free

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ACCRETECH (Europe) GmbH, headquartered in Munich and with locations in Italy, France, the UK, Hungry and Turkey works with sales and service partners throughout Europe. This means you always have a contact partner locally who can help you to implement integrated solutions for battery testing, quality assurance in production processes and for semiconductor production.