The smaller the microchip, the greater the requirements of the wafer industry. We offer systems for high-precision wafer edge profiling directly after the wafers have been sawn out of the silicon single crystal (ingot). The modular system of the ACCRETECH Wafer Edge Grinder can be configured for wafer sizes from 2-12″ and for diverse materials (Si, GaAs, sapphire Si, SiC). Thanks to its compact design, the wafer edge grinder takes up as little space as possible. The automatic feedback function independently analyses the results, and the touch panel ensures easy operation.