Edge grinding machine for wafer manufacturing up to 300 mm

Wide Scope of Application

High Degree of Process Security

High-Precision Quality Control
  • Suitable for various wafer materials and connections for example GaAs, SiC, GaN etc.
  • Newly developed Grinding Unit for better rotational precision of the spindle and the profile sharpness
  • non-contact measurement technology ensures stable alignment
  • Performs a non-contact measurement of the wafer thickness at numerous different locations before grinding
  • Performs a non-contact measurement of the diameter and the indent depth
  • Mirror Finish Technology to reduce grinding damage

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+49 (0)89 546788-0

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