Edge grinding machine for the new generation of 450 mm wafers

Precise profiling of large wafers

Integrated quality control

Outstanding results
  • Improved use of space due to the compact design
  • High grinding precision thanks to synchronised X, Y, θ Support Control
  • Simple operation with the Touch Panel
  • Automatic Feedback from the preparation results
  • Optimum preparation of the subsequent process steps

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+49 (0)89 546788-0

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