Wafer Dicing Machines – Blade Dicer
The task of the Wafer Dicing Machines is to separate the whole wafers into chips. Blade Dicers cut the wafers using fine saw blades. Our semi and fully automatic ACCRETECH Blade Dicers are available for wafers up to 150 mm, 200 mm and 300 mm diameter. In addition to user-friendliness, their excellent properties include high processing speed and the very compact construction. The AD2000T and AD3000T, with two opposite-facing spindles, are the smallest fully automatic Blade Dicers in the world, setting new standards with their small footprint and high-efficiency.