The Fully Automatic Dicing Machine for Maximum Precision with 200 mm Wafers
AD2000T/S* – Compact, Powerful, and Versatile – The New Standard in Dicing
Reduced Footprint with High Productivity
The AD2000T/S* sets new standards in space efficiency. The diagonal arrangement of the optional twin spindles allows for top precision in a minimal footprint. Install more machines in the same space – ideal for your production line.
Outstanding Cutting Quality and Throughput
Thanks to a powerful spindle (1.8 kW, up to 60,000 rpm) and optimized servo motors on all axes, the AD2000T/S* delivers extremely short cycle times. Synchronized X-, Y-, and Z-axis movement significantly reduces overall process time.
Versatile Applications
- The AD2000T/S* is the ideal solution for:
- Thin and thick substrates
- Hard and brittle materials (ceramics, glass, silicon)
- Electronic components and power semiconductors
Intuitive and Simple Operation
The AD2000T/S* is easily controlled via a 17-inch touchscreen with a modern GUI. Proven AD/SS series software ensures easy recipe switching and fast process adjustments.
Future-Proof Options
- Ionizer and barcode reader
- UV irradiation and blade re-dressing
- Support for single and twin spindle configurations (S and T)
- Storage for over 10,000 recipes
- Optimized vacuum control with up to 50% less air consumption
Your Key Benefits at a Glance
- Space-saving and modular design
- Very high throughput with minimal vibration
- Reliable performance even with difficult materials
- Intuitive operation and short learning curve
- Extensive options for customized process requirements
Want to see the AD2000T/S* in action or receive a free quote? Our experts are happy to help!
Technical Specifications
- Max. workpiece size: Ø200 mm
- Spindle options: Single or Twin Spindle (S/T)
- Spindle power: 1.8 kW at 60,000 rpm (optional 2.2 kW)
- Cutting speed (X/Y): 1000 mm/s (X), 300 mm/s (Y)
- Repeatability: ±0.001 mm
- Dimensions (W × D × H): 1080 × 1190 × 1900 mm
- Weight: approx. 1100 kg
Explore Our Full Product Line
Download the product overview to see how our solutions can support your needs.
Detailed insights into dicing technology
Our whitepaper reflects our opinion on how modern dicing systems combine material versatility with process reliability.
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
