Efficient Cooling System for Dicing Machines: Cutting Water Recycling
Sustainable Cooling and Stable Process Conditions for High-Precision Semiconductor Manufacturing
The U-FW-200R Cutting Water Recycling System delivers an advanced solution for managing the cooling water used in semiconductor dicing processes. By efficiently recycling wastewater and precisely controlling water temperature, this system reduces overall water consumption while improving machining stability and cutting accuracy.
During dicing, wastewater is collected and purified using a sedimentation filter. The treated water is then temperature-stabilized through an integrated control system and recirculated into the cutting process. This technology ensures consistent cooling performance and precise spindle temperature control—both critical for high-precision semiconductor processing.
Key Benefits of the U-FW-200R Recycling System:
- Sustainable water reuse: Recycles wastewater from the dicing process to significantly reduce water consumption and environmental impact.
- High process stability: Maintains stable cooling conditions with a temperature accuracy of ±1 °C to support precise machining.
- Efficient cooling and control: Delivers 600 W cooling capacity at a flow rate of 12 L/min for cutting water; the spindle cooling circuit provides 6 L/min for consistent thermal management.
- Reduced maintenance costs: Thanks to a closed-loop water circuit and integrated dual-stage filtration (15 µm and 5 µm), system maintenance is minimal.
Technical Specifications of the U-FW-200R:
- Cutting water flow rate: 12 L/min
- Cutting water temperature range: 20–27 °C
- Spindle cooling water flow rate: 6 L/min
- Spindle cooling water temperature range: 20–25 °C
- Dimensions (W × D × H): 430 × 920 × 1,500 mm
- Weight: 230 kg
- Temperature control accuracy: ±1 °C
The U-FW-200R Cutting Water Recycling System helps reduce water usage while improving both process stability and dicing accuracy.
