Fully Automatic Dicing Machine AD3000TW: Precision for Large Substrate Packages
The AD3000TW offers an outstanding solution for processing large substrate packages with a special dual-axis spindle configuration, enabling maximum productivity at reduced cost.
The AD3000TW is a fully automatic dicing machine specifically developed for processing large substrate packages. Thanks to its innovative dual-axis spindle configuration, the machine optimizes processing time and boosts productivity. Particularly impressive is the AD3000TW’s ability to process large substrates of up to 315 mm x 315 mm.
The AD3000TW uses servo motors on the X, Y, and Z axes, significantly increasing processing speed. Furthermore, the machine is capable of processing multiple substrate sheets simultaneously, resulting in higher overall throughput.
Key Features of the AD3000TW
- Processes substrates up to 315 mm x 315 mm
- High precision for materials such as QFN, BGA, and ceramics
- Enhanced productivity through dual-axis spindle configuration and servo motors
- Reduced processing times thanks to intelligent software control
- User-friendly operation via 17-inch touch panel
- Space-saving design: Up to 5 units can fit in a conventional installation space
Specifications of the AD3000TW
- Maximum workpiece size: Φ300 mm, □315 mm
- Processing method: Frame handling
- Spindle configuration: Opposed twin layout
- Spindle power: 1.8 kW
- Maximum spindle speed: 60,000 rpm
- X-axis: Feed rate 0.1 to 300 mm/s, return speed 1,000 mm/s
- Y-axis: Resolution 0.000078 μm, positioning accuracy within 0.002 mm/330 mm
- Z-axis: Repeatability 0.001 mm
- Standard compatible blade diameters: Φ48 to 60 mm
- Dimensions (W x D x H): 1,560 mm x 1,670 mm x 1,900 mm
- Weight: 1,700 kg
Boost your productivity with the AD3000TW.
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Detailed insights into dicing technology
Our whitepaper reflects our opinion on how modern dicing systems combine material versatility with process reliability.
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