The ACCRETECH polish grinder is a single device that both grinds and polishes. Because of this, ultra-thin wafers measuring up to 15 μm can be made in industrial mass production. Polishing the back of the wafer reliably removes damage caused during grinding, and reduces surface tension. The integrated stress release technology ensures that the wafer remains stable during the entire process. Polishing is carried out without water, and helps to keep the carbon footprint as small as possible.