Very compact, fully automatic Wafer Dicing machine for 200 mm

Smallest dicing machine in the world

Highest Space Efficiency

High Throughput

Low Cost of Ownership
Das Bild zeigt eine Frontansicht eines Dicers AD2000T.
  • High Processing Speed
  • X-axis up to 1,000 mm/ Y-axis up to 300 mm/s
  • The smallest blade-to-blade distance worldwide
  • Graphical User Interface with Help Function
  • Easy & Simple Kerf Check Function
  • Standard Spindle up to 60,000 rpm, optional High Speed Spindle up to 80,000 rpm
  • Simple Maintenance – Easy to Access

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+49 (0)89 546788-0

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