Very compact, fully automatic Wafer Dicing machine for 200 mm

Smallest dicing machine in the world

Highest Space Efficiency

High Throughput

Low Cost of Ownership
  • High Processing Speed
  • X-axis up to 1,000 mm/ Y-axis up to 300 mm/s
  • The smallest blade-to-blade distance worldwide
  • Graphical User Interface with Help Function
  • Easy & Simple Kerf Check Function
  • Standard Spindle up to 60,000 rpm, optional High Speed Spindle up to 80,000 rpm
  • Simple Maintenance – Easy to Access

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+49 (0)89 546788-0

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