AD2000T/S
Very compact, fully automatic Wafer Dicing machine for 200 mm
Highest Space Efficiency
High Throughput
Low Cost of Ownership
- High Processing Speed
- X-axis up to 1,000 mm/ Y-axis up to 300 mm/s
- The smallest blade-to-blade distance worldwide
- Graphical User Interface with Help Function
- Easy & Simple Kerf Check Function
- Standard Spindle up to 60,000 rpm, optional High Speed Spindle up to 80,000 rpm
- Simple Maintenance – Easy to Access