HRG200 X

Fully automatic High Rigid Grinder for wafers up to 200 mm

High speed

High Degree of Process Security

Automatic Cleaning Function
ACCRTECH Europe GmbH - Produkte - Semiconductor - %%title%%
  • Double axis
  • Less grinding damage, shorter processing times
  • Low Costs
  • High Precision
  • Surface Grinding with Mirror Finish
  • Integrated cleaning unit that prevents silicon dust drying on the wafer surface
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