UF200R

Fully automatic Wafer Prober for 120 to 200 mm wafers

High Throughput

Wide Scope of Application

High Planning Safety

Numerous Options for Upgrading

Now with the latest SW and Electronics generation
Also available for numerous special applications, such as MEMS wafer handling
Highest speed 300 mm/s in the XY-axis, 30 mm/s in the Z-axis, spindle rotation angle +-5 deg
With second card feeder as an option
Wafer Handling with robot arm and backside holding

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UF200R

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