Fully automatic Wafer Prober for 120 to 200 mm wafers

High Throughput

Wide Scope of Application

High Planning Safety

Numerous Options for Upgrading
  • Now with the latest SW and Electronics generation
  • Also available for numerous special applications, such as MEMS wafer handling
  • Highest speed 300 mm/s in the XY-axis, 30 mm/s in the Z-axis, spindle rotation angle +-5 deg
  • With second card feeder as an option
  • Wafer Handling with robot arm and backside holding

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