ChaMP 311/332

High Performance CMP Technology for wafers up to 300mm

Maximum Process Safety

Optimum Interaction of all Components

Outstanding Results

Can be configured for high volumes
  • Modular and compact design
  • Dry in Dry Cut with cleaning option
  • Polishing head with Air Float Technology
  • Easy Maintenance
  • End Point Detection (EPD) for high precision and even polishing
  • Processed Cu / STI/ ILD / SOI etc.
  • For ChaMP 332 also with 3 polishing tables and 2 polishing heads – ideal for mass production

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