ChaMP 332
High Performance CMP Technology for wafers up to 300mm
Optimum Interaction of all Components
Outstanding Results
Can be configured for high volumes
- Modular and compact design
- Dry in Dry Cut with cleaning option
- Polishing head with Air Float Technology
- Easy Maintenance
- End Point Detection (EPD) for high precision and even polishing
- Processed Cu / STI/ ILD / SOI etc.
- For ChaMP 332 also with 3 polishing tables and 2 polishing heads – ideal for mass production