Semi-automatic Wafer Dicing machine for 300 mm

Small ecological footprint

Wide Scope of Application

High User Friendliness
Das Bild zeigt eine Frontansicht eines Dicers SS30.
  • Suitable for different types of workpieces: 12-inch Frame, rectangular workpieces with max. 350 x 250 mm
  • Higher X-axis throughput 800 mm/sec, Y-axis 300 mm/sec and Z-axis 80mm/sec
  • Standard Spindle up to 60,000 rpm, optional High Speed Spindle up to 80,000 rpm, High Power Spindle with 30,000 rpm
  • Microscope with High Resolution
  • Easy & Simple Kerf Check Function
  • Simple operation with 17-Inch Touch Panel and new Graphical User Interface
  • USB Port as a standard option
  • Simple maintenance – easy to access

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+49 (0)89 546788-0

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