Wafer Dicing Machines – Package Dicer

Remain competitive. Reduced costs and increased efficiency are increasingly important in the high volume production of semiconductor elements. With our Dicer package, we offer a complete solution for the separation of BGA and QFN products. The dicing machine is directly coupled to a pick-and-place system. With its newly developed technology with two independent stages and transportation routes, this dicer has great potential for reducing operating costs (“cost of ownership”)

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Package Dicer

High speed, high cycle rate, high cost savings. Our PS280 package singulation system carries out several work stages in parallel The large 17-inch touchscreen monitor also ensures easy operation.

 PS 280