Tried-and-tested 300 mm Frame Handling Prober with Frame Gripper Function

For 300 mm Wafers on Dicing Frames

Numerous safety functions

Available with wafer handling on request

Product-specific configuration
  • For Wafers up to 300 mm on Dicing Frames
  • Optionally with wafer handling – for maximum versatility in production
  • Software to correct the chip position
  • Automatic wafer alignment
  • Automatic sample needle for contact point alignment
  • Optional with multiple probing, needle cleaning, GP-IB interface, sample inspection, printer, barcode reader, wafer ID reader, color camera and flat loader

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