Semi-automatic Dicer Machine from the new Small Footprint Generation.

Low space requirement

High flexibility

High speed

Low scrap production
Das Bild ist eine Darstellung des Dicers SS10 in der Frontansicht.
  • Smallest and quickest 6 inch Dicing Machine in the world
  • Suitable for various types of wafers
  • Image preparation processor automatically adapts to the different wafers
  • High Performance Spindle with 60,000 rpm
  • 14-Inch Touch Panel and new Graphical User Interface
  • Microscope with High Resolution
  • Easy & simple kerf check function
  • Simple operation with 17-Inch Touch Panel and new Graphical User Interface

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+49 (0)89 546788-0

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