Metal Bond Dicing Blades for High-Performance Ceramics
YM/AM Series – Ultimate Precision and Tool Life
Our YM/AM Series dicing blades are specifically designed for high-precision cutting of technical ceramics such as aluminum oxide (Al₂O₃), aluminum nitride (AlN), silicon nitride (Si₃N₄), and other brittle-hard materials. The metal-bonded cutting edge ensures outstanding cut quality, minimal burr formation, and significantly longer tool life compared to conventional resin or electroplated bonds.
Typical Applications of Our Metal Bond Blades:
- Dicing of LED substrates (Al₂O₃-based)
- Segmenting LTCC components
- Cutting thick-film ceramics
- Fine dicing of glass ceramics and technical glass
- Processing electronic substrates and components
Advantages of the YM/AM Series:
- Highest Cutting Precision: Clean, vertical cuts even with complex substrate structures
- Extended Tool Life: Superior wear resistance thanks to durable metal bonding
- Burr-Free Cutting: Avoids chipping, cracking, or edge protrusions
- High Processing Speed: Enables cost-efficient dicing with high feed rates
- Versatile Applications: Suitable for a wide range of ceramic and glass-like materials
Benefit from our years of expertise in precision processing of advanced materials. Our team is happy to provide personalized support!
