Maximum Performance and Stability for Ceramic Cutting
Nickel Bond Dicing Blade – MN Half-Slit Series
The MN Half-Slit Series sets a new standard in semiconductor manufacturing and precision processing. This specially developed nickel bond blade combines high rigidity with an innovative half-slit design, significantly enhancing both performance and stability when processing MLCCs (Multilayer Ceramic Capacitors), raw ceramics, and other brittle materials.
With the MN Half-Slit Series, you benefit from optimized cutting performance that delivers outstanding precision, extends blade life, and prevents blade breakage — a common issue with ultra-thin dicing blades.
Advantages of the MN Half-Slit Series:
- Improved Cutting Dust Discharge:
The half-slit design reduces the adhesion of cutting dust to the blade surface, lowering maintenance needs and increasing processing efficiency. - Prevents Blade Breakage:
Ideal for ultra-thin blades – the innovative half-slit structure minimizes the risk of cracking and ensures even stress distribution during cutting. - Optimized for MLCCs and Raw Ceramics:
This series is especially well-suited for cutting MLCCs, green ceramic sheets, and other hard, brittle materials that require the highest level of precision.
Blades from the MN Half-Slit Series help you optimize your cutting processes and boost productivity. They are specifically designed for semiconductor applications where precision and durability are critical.
Learn more about the MN Half-Slit Series and its applications in semiconductor manufacturing!
