Automated Wafer Grinding Systems for flexible Backend Production

Advanced Grinding solutions enable consistent and cost-effective backend processes for high-wage regions

Modular systems designed for product variations and low labor costs

As semiconductor manufacturing shifts toward smaller batches, more diverse substrates and thinner wafers, wafer grinding has taken on new strategic importance, especially in high-wage regions where labor costs and process efficiency are critical.

Modular Platform Architecture configures semi- or fully automated systems that scale with your needs and support fast changeovers.
MES and Data Integration provides traceable, recipe-driven production, predictive maintenance, and process optimization.
Material and Format Adaptability processes a wide variety of wafer types, sizes, and formats.

Who should read this?

Process engineers
Fab managers
Operation leaders and planners
Strategic decision makers
For everyone who is interested in the topic

Are you ready to upgrade your backend process?

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Here you can download the white paper for free

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ACCRETECH (Europe) GmbH, headquartered in Munich and with locations in Italy, France, the UK, Hungry and Turkey works with sales and service partners throughout Europe. This means you always have a contact partner locally who can help you to implement integrated solutions for battery testing, quality assurance in production processes and for semiconductor production.