High-Precision Dicing Blades for Wafer Processing – Enabling Efficient and Nearly Burr-Free Singulation
Hub Blade FTB/CCB Series: Maximum Cutting Accuracy for Wafers, Silicon Carbide, and Compound Wafers
Our dicing blades offer the perfect solution for precise and nearly burr-free singulation of wafers in semiconductor production. Using our innovative technology, these blades allow for exact processing of silicon wafers as well as complex compound materials such as silicon carbide (SiC) and lithium niobate (LiNbO3).
Why Choose Our Dicing Blades?
- High Cutting Speed: Enables efficient processing with maximum precision.
- Chipping Minimization: Our special plating technology significantly reduces chipping, resulting in higher product quality.
- Versatility: Our blades cover a wide range of processing requirements – from step cutting to full cutting.
- Long-Term Performance: Uniform abrasive grain distribution ensures consistent blade performance over extended periods, optimizing productivity and blade lifespan.
Applications and Processed Materials:
- Silicon Wafers
- Compound Wafers
- Silicon Carbide (SiC)
- Lithium Niobate (LiNbO3)
Contact us for more information and customized solutions for your wafer processing needs.
