Fully Automatic Laser Dicing Machine for Φ300 mm Semiconductor Wafers
ML3200 – Maximum Precision and Efficiency
The ML3200 is the answer to the increasing demands in semiconductor manufacturing. As a fully automatic laser dicing machine with IR laser technology, it enables precise, fast, and contactless wafer processing – ideal for the latest MEMS devices and other sensitive semiconductor components. Our machine not only boosts your productivity but also helps significantly reduce costs by maximizing yield while minimizing resource consumption.
Key Benefits of the ML3200:
- Maximum Productivity with High Precision:
With processing speeds of up to 800 mm/s, the ML3200 enables ultra-fast wafer processing. Benefit from high throughput and consistent, reliable performance that optimizes your production lines. - Cost Reduction Through Higher Yields:
The ML3200 helps lower production costs by reducing the dicing street width, increasing chip yield by up to 20%. This yield improvement means more profitable chips per wafer and a faster return on investment. - Completely Dry – No Water, No Problem:
The dry process of the ML3200 is ideal for MEMS devices and other sensitive components that cannot tolerate water or moisture. Thanks to contactless dicing technology, your wafer surfaces remain undamaged. - Flexibility Through Versatile Options:
With numerous optional features, such as internal cleaning (Class 100) and wafer thickness measurement, the machine can be tailored precisely to your specific requirements. You get a customized solution that evolves with your production process. - Future-Proof Technology:
Whether you’re processing ultra-thin wafers or standard wafers, the ML3200 adapts to different material thicknesses without compromising on quality.
Technical Highlights:
- Maximum Wafer Size: Φ300 mm
- Processing Speed (X-Axis): Up to 2,100 mm/s
- Positioning Accuracy: 0.002 mm
- Process Types: LAG (Laser After Grinding) and GAL (Grinding After Laser)
- Dimensions: 1,712 mm × 2,960 mm × 1,800 mm
- Weight: 3,000 kg
Why the ML3200 Is the Perfect Choice for Your Production:
- Higher yields mean more profitable chips with lower material costs
- Optimized speed results in faster production times and higher throughput
- Water-free operation protects sensitive components and lowers resource expenses
- Customizable with numerous optional features to optimize quality and productivity
Learn more about how the ML3200 can boost efficiency in your manufacturing process.
