Automatic Cleaning System for Wafers up to 300 mm – A-CS-300
Efficient Spin Cleaning and Drying for Diced and Scribed Wafers – Compatible with Dicing Frames up to 12 Inches
The A-CS-300 is a compact, fully automatic cleaning system designed for spin cleaning and drying of semiconductor wafers up to 300 mm in diameter. It is specifically engineered for post-processing of diced or scribed wafers, commonly handled with semi-automatic dicing machines.
Featuring a high-speed rotating spindle (up to 3000 rpm) and a precisely controlled swing-type cleaning nozzle, the system automatically adapts to the size of the workpiece. Its multi-step cleaning process—using an air/water mixture, rinse cleaning, and high-pressure air drying—ensures thorough particle removal and reliable drying, supporting maximum process cleanliness for downstream operations.
Key Features of the A-CS-300 Automatic Cleaning System:
- Frame compatibility: Supports wafer frames from 5″ to 12″ (Accretech standard)
- High rotational speed: Turntable speed adjustable from 30 to 3000 rpm for optimal cleaning performance
- Multi-stage cleaning process:
- Air acceleration cleaning with ultrapure water and compressed air
- Rinse cleaning up to 0.4 MPa
- Compressed air drying up to 0.7 MPa
- Compact footprint: Ideal for cleanroom environments with limited space
- Optional high-pressure cleaning: For advanced cleaning requirements
Technical Specifications:
- Supported frame diameter: Up to Φ300 mm
- Dimensions (W × D × H): 490 × 650 × 1400 mm
- Weight: 160 kg
- Power supply: 3-phase, AC 200 V, 50/60 Hz
- Max. power consumption: 3 kVA
- Air supply: 0.5–0.7 MPa, 200 L/min (ANR)
- Water supply: 0.2–0.5 MPa, 2 L/min
Experience efficient wafer cleaning with the A-CS-300 – contact us for more information or a customized quote.
