High-rigidity 3-axis grinding machine for semiconductor manufacturing
HRG3000RMII
The HRG3000RMⅡ is a fully automatic high-rigid 3-axis grinder designed to support modern semiconductor manufacturers in the precise and efficient processing of wafers up to 300 mm and 200 mm diameter. It enables ultra-thin, highly precise, and particularly gentle grinding while reducing process time and lowering processing costs.
Key Benefits of the HRG3000RMⅡ:
- Ultra-precise and ultra-fast processing for modern semiconductor applications
- Gentle material removal to minimize surface damage
- High accuracy ensuring consistent quality for every wafer
- Mirror-like surfaces through ultra-fine grinding processes
- Lower process costs thanks to efficient machine operation
The HRG3000RMⅡ sets new standards in wafer processing and ensures you meet the growing demands of the semiconductor industry.
Contact our team for a non-binding consultation about the HRG3000RMⅡ — the ideal solution for high-end wafer processing.
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