Fully Automatic UV Laser Dicing Machine
AL3000 – For 300 mm Semiconductor Wafers
The AL3000 is a state-of-the-art, fully automatic UV laser dicing machine designed for the precise processing of 300 mm semiconductor wafers. Developed for use in semiconductor manufacturing, it combines an innovative laser engine with an extremely stable machine platform to ensure high cutting quality and maximum productivity – even with sensitive materials such as low-k dielectrics or metal layers.
Key Features
- Fully Automated Workflow
Integrated processes from the application of water-soluble protective films to laser dicing and cleaning – without manual intervention. - Optimized for Low-k Materials & Metals
UV laser technology allows gentle processing with minimal thermal stress and high precision. - High Throughput without Compromising Quality
The unique combination of laser control and stable mechanics eliminates the typical trade-off between quality and speed. - Intuitive Operation
17-inch touch panel with user-friendly GUI – known from the AD/SS series – for simple and efficient control. - Suitable for Φ300 mm Wafers
Flexible integration in modern production environments.
Typical Applications
- Laser grooving for dicing-before-grinding processes
- Preparation of sensitive structures for plasma dicing
- Gentle processing in advanced packaging
Technical Specifications – AL3000
- Processing Method: Ablation (UV laser)
- Laser Source: Solid-state laser, UV (355 nm), Q-switch
- Max. Wafer Size: Φ305 mm
- Cutting Area (X × Y): 310 mm × 310 mm
- Max. Speed (X-Axis): 1,000 mm/s
- Max. Speed (Y-Axis): 300 mm/s
- Positioning Accuracy: ±0.078 µm
- Repeatability: ±1.0 µm
- Max. Rotation Angle (θ-Axis): 380°
- Power Supply: 3-phase 200–220 V (380/415 V optional)
- Power Consumption: approx. 2.0 kVA
- Air Supply: 0.5–0.7 MPa, Ø 400 L/min
- Nitrogen Supply: 0.3–0.5 MPa, Ø 30 L/min
- DI Water Consumption (max.): 6.0 L/min at 0.3–0.5 MPa
- Exhaust Volume: ≥ 4.0 m³/min
- Machine Dimensions (W × D × H): 1,645 mm × 1,680 mm × 1,800 mm
- Weight: approx. 2,500 kg<(li>
- A chiller and a dust separator are included as additional equipment.
Get all the details on the AL3000 laser dicing machine and discover how our system can boost your production efficiency.
