High-Performance Metal Bond Dicing Blade
HM Series for Advanced Electronics Processing
The HM Series metal bond dicing blade is specifically designed for the precise cutting of a wide range of electronic components—including QFN and BGA packages, glass, ceramics, and various substrate materials.
Thanks to advanced sintering technology, uniform grit distribution, and specially engineered bonding properties, this blade offers an exceptional combination of cutting quality, durability, and stable performance – even on brittle or hard materials.
Key Features & Benefits of the HM Series Blade:
- Versatile Applications: Ideal for QFN packages, electronic substrates, glass, and ceramics
- High-Precision Cuts: Special grit technology enhances cut quality and edge definition
- Advanced Sintering Technology: Ensures maximum blade stability and long service life
- Outstanding Wear Resistance: Reduced blade wear while maintaining consistent performance
Discover how the HM Series can make your cutting processes more efficient, precise, and cost-effective – our expert team is here to support you.
