Precise, Low-Burr Cutting of QFN and DFN Packages

Resin Bond Dicing Blades – PG Series

The PG Series dicing blades are specifically developed for precise cutting of semiconductor packages such as QFN (Quad Flat No-lead), DFN (Dual Flat No-lead), and Wettable Flank QFN. With high cut quality, minimal burr formation, and long tool life, they are ideal for use in advanced electronics manufacturing.

Your Key Benefits at a Glance

Low-burr cutting even at high processing speeds
Extended tool life thanks to high wear-resistant resin bond
Suitable for the latest package types, including Wettable Flank QFN and DR-QFN
Low thermal impact – ideal for sensitive components

PG Series blades are available in various specifications tailored to cutting speed, package size, and material type. Our application experts are happy to help you choose the right blade.

Request more information about Resin Bond Blade PG Series

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