The Compact and Flexible Semi-Automatic Dicing Machine for 250 mm Wafers
SS20 – Impressive Performance with Minimal Footprint
The SS20 dicing machine is the ideal solution for users seeking top-quality wafer separation with ease of operation. As part of the new small-footprint generation, it offers high-speed performance, low resource consumption, and flexible application – including for square wafers up to 250 mm.
Key Features of the SS20 Dicing Machine
- Compact design – saves valuable production space/li>
- Versatile use – supports various wafer types, including square wafers up to 250 mm
- High spindle performance – up to 60,000 rpm (optional 80,000 rpm) for clean, fast cuts
- Precision microscope – high resolution for accurate cut evaluation
- User-friendly control – 17″ touchscreen with modern graphical user interface
- Efficient quality assurance – easy & simple kerf check function reduces scrap and setup time
Your Benefits with the SS20
- Lower operating costs: thanks to space- and resource-efficient design
- Maximum flexibility: supports a wide range of wafer and material types
- Fast commissioning: intuitive operation with minimal training required
- Reliable quality: state-of-the-art technology ensures consistently high process results
Our expert team will be happy to advise you on the optimal SS20 configuration for your needs.
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process..
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
