The Compact and Flexible Semi-Automatic Dicing Machine for 250 mm Wafers
SS20 – Impressive Performance with Minimal Footprint
The SS20 dicing machine is the ideal solution for users seeking top-quality wafer separation with ease of operation. As part of the new small-footprint generation, it offers high-speed performance, low resource consumption, and flexible application – including for square wafers up to 250 mm.
Key Features of the SS20 Dicing Machine
- Compact design – saves valuable production space/li>
- Versatile use – supports various wafer types, including square wafers up to 250 mm
- High spindle performance – up to 60,000 rpm (optional 80,000 rpm) for clean, fast cuts
- Precision microscope – high resolution for accurate cut evaluation
- User-friendly control – 17″ touchscreen with modern graphical user interface
- Efficient quality assurance – easy & simple kerf check function reduces scrap and setup time
Your Benefits with the SS20
- Lower operating costs: thanks to space- and resource-efficient design
- Maximum flexibility: supports a wide range of wafer and material types
- Fast commissioning: intuitive operation with minimal training required
- Reliable quality: state-of-the-art technology ensures consistently high process results
Our expert team will be happy to advise you on the optimal SS20 configuration for your needs.
Explore Our Full Product Line
Download the product overview to see how our solutions can support your needs.
Detailed insights into dicing technology
Our whitepaper reflects our opinion on how modern dicing systems combine material versatility with process reliability.
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process..
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
