Semi-Automatic Dicing Machine for 300 mm Wafers
SS30 – Compact. Precise. Powerful.
The semi-automatic dicing machine SS30 sets new standards for the semi-automatic separation of 300 mm wafers and rectangular substrates up to 300 × 250 mm. With its high-stability bridge construction and servo-driven axes, it enables fast and precise sawing – even for delicate and hard-to-cut materials.
Compact Design
Thanks to its space-saving construction and proven gate-type architecture, the SS30 can be easily integrated into existing production lines.
Maximum Cutting Precision
The highly rigid structure minimizes vibrations and thermal effects. The result: outstanding cutting accuracy for every application.
High Productivity
The 1.8 kW high-performance spindle (60,000 rpm) and fast, servo-controlled axis movement ensure minimal cycle times and maximum throughput.
Easy Operation
An intuitive 17-inch touchscreen with graphical user interface allows for easy recipe selection and quick changeovers. The unified software platform of the AD/SS series reduces training effort.
Flexibility
Whether 300 mm wafers or substrates up to 300 × 250 mm – the SS30 supports a wide range of applications in the semiconductor and electronics industries.
Learn more about the SS30 – your solution for precise and cost-efficient dicing.
Explore Our Full Product Line
Download the product overview to see how our solutions can support your needs.
Detailed insights into dicing technology
Our whitepaper reflects our opinion on how modern dicing systems combine material versatility with process reliability.
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
