Temperature Control System for Precision Dicing Processes
Maximum Cooling Performance and Constant Temperature for High-Accuracy Semiconductor Processing
The U-FW-300B temperature control system ensures precise water temperature regulation to provide your dicing machine with consistently tempered cooling water. By minimizing thermal distortion, the system helps maintain optimal cutting conditions and enhances processing accuracy.
With a stable temperature range of 20 to 25 °C and precision control within ±0.5 °C, the U-FW-300B supplies consistently conditioned water to both the blade and spindle cooling systems. This contributes to superior process stability and long-term reliability in semiconductor manufacturing.
Key Features of the U-FW-300B Temperature Control System:
- Precision temperature regulation: Minimizes the effects of thermal expansion and contraction on machine components, improving processing accuracy.
- High-efficiency cooling: Offers up to 5300 W of cooling capacity for blade cooling and 1700 W for spindle cooling, ensuring consistent temperature control.
- Reliable water supply: Delivers stable flow rates of 25 L/min for blade cooling and 8 L/min for spindle cooling to maintain system performance.
Technical Specifications:
- Dimensions (W × D × H): 372 × 1,230 × 1,200 mm
- Weight: 265 kg
- Temperature range: 20 – 25 °C
- Temperature accuracy: ±0.5 °C
This advanced temperature control unit not only improves machining precision but also extends the service life of your equipment.
Maximize process efficiency and product quality with the U-FW-300B temperature control system.
