Ultra-Hard Dicing Blades for Precision Cutting of Metal and Resin Materials
Burr-Minimized Separation of Ductile Non-Ferrous Metals and Engineering Plastics – Designed for Semiconductor Manufacturing
Accretech’s ultra-hard dicing blades are engineered for high-precision singulation of ductile non-ferrous metals such as copper and aluminum, as well as polymer-based materials with minimal burr formation. These blades ensure excellent cut quality and dimensional accuracy, making them ideal for semiconductor backend processes, lead frame separation, and other high-precision manufacturing environments.
Key Features of Ultra-Hard Dicing Blades
- Minimal Burr Formation: Advanced edge geometry and bonding structure reduce mechanical stress, enabling clean cuts with minimal burrs—critical for downstream assembly and packaging in semiconductor production.
- Material Versatility: Optimized for a wide range of workpiece materials, including ductile non-ferrous metals (e.g. copper, aluminum), stainless steels, and thermoset or thermoplastic resins used in electronic packaging.
- High-Precision Cutting Performance: Designed for narrow kerf widths and low blade wear, ensuring long tool life, consistent cut quality, and tight dimensional tolerances in demanding dicing operations.
Why Choose Accretech Ultra-Hard Dicing Blades
Our ultra-hard dicing blades are optimized for critical cutting applications where precision, reliability, and process efficiency are paramount. By reducing burr formation and eliminating the need for secondary processing, they significantly increase throughput and yield in semiconductor assembly and component manufacturing.
Enhance your production efficiency and achieve superior cut quality with Accretech’s ultra-hard dicing blades.
