Fully Automated 200 mm Frame Handling Prober

FP2000

The FP2000 is a fully automated 200 mm frame handling prober with an integrated frame-gripper function. This system offers a wide range of applications, including testing entire wafers as well as wafers on dicing frames.

Thanks to its modular design, the FP2000 wafer prober can be easily expanded and adapts flexibly to different requirements in semiconductor testing.

Features and Specifications

  • Fully automated operation
  • Supports wafers on dicing frames: 2-8-1, 2-6-1
  • Compatible with standard wafers in sizes: 5″, 6″, and 8″
  • Newly developed software for chip position correction
  • Automatic wafer alignment
  • Automatic probe needle adjustment for contact point positioning

Optional Expansions

  • Multiple die probing
  • Needle cleaning
  • GP-IB interface
  • Probe mark inspection
  • Printer
  • Barcode reader
  • Wafer ID reader
  • Color camera
  • Flat loader

Want to learn more about technical details, supported wafer sizes, and expansion modules?

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