The Compact and Fast Dicing Machine for 6-Inch Wafers
SS11 Semi-Automatic Dicer
The SS11 is a semi-automatic dicing machine designed for high-precision cutting of Φ150mm wafers. Its compact design and high-performance spindle deliver both speed and accuracy, supporting a wide range of materials, from standard silicon to ceramics and glass.
Key Features
Compact, High-Throughput Design
- Supports Φ150 mm wafers in a space-efficient footprint.
- Minimal footprint maximizes floor space for production efficiency.
- Supports a broad range of materials, including silicon and hard-to-cut substrates.
High-Performance Spindle
- Standard 1.8 kW spindle with maximum rotation speed of 60,000 rpm.
- Optional 2.2 kW high-torque spindle available for demanding applications.
Enhanced Productivity
- Servomotorized X, Y, and Z axes with gate-type structure.
- High-speed, precise motion improves throughput without compromising accuracy.
User-Friendly Operation
- 17-inch touch panel with intuitive GUI.
- Simple icon-driven controls for smooth operation.
- Operates with the same interface as the AD/SS Series for consistency.
Specifications
- Maximum Work Size: Φ150 mm
- Spindle: Single spindle, 1.8 kW (optional 2.2 kW)
- Maximum Spindle Speed: 60,000 rpm
- X-Axis Speed: 0.1–300 mm/sec (send), 750 mm/sec (return)
- Y-Axis Resolution: 0.0001 mm
- Y-Axis Positioning Precision: 0.002 mm / 162 mm
- Y-Axis Repeatability: 0.001 mm
- Z-Axis Compatible Blade Diameter: Φ48–Φ60 mm
- Dimensions (W×D×H): 495 × 880 × 1,715 mm
- Weight: 389 kg
Optional Accessories / Features
OPC (Optical Cutter Set)
- Automatically measures blade wear using a contactless optical sensor.
BBD (Blade Breakage Detector)
- Monitors blade condition in real time with an optical sensor.
Maintenance & Operability
- Improved interface via 17-inch touch panel ensures quick familiarization and smooth operation.
Why should you choose SS11?
Compact, precise, and versatile — the SS11 combines high-output performance with an intuitive interface, helping operations achieve reliable, high-quality wafer dicing efficiently.
Explore Our Full Product Line
Download the product overview to see how our solutions can support your needs.
Detailed insights into dicing technology
Our whitepaper reflects our opinion on how modern dicing systems combine material versatility with process reliability.
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