Semi-Automatic Dicing Machine for Maximum Precision
AD20T/S
The AD20T/S is a semi-automatic dicing machine featuring patented technology, specially developed for processing wafers up to Φ200 mm. Its compact design and powerful twin-spindle system ensure maximum productivity with minimal space requirements.
Features & Benefits of the AD20T/S
- High throughput with dual-spindle system
The opposing 2-axis spindle setup allows for simultaneous and ultra-fast cuts with consistently high quality. - Optional single-spindle operation
Equipped with a dual-spindle system but can be operated as a single-spindle when needed – for maximum process flexibility. - High cutting accuracy and quality
Thanks to the innovative step-cut and 1-pass full-cut modes, the AD20T delivers clean and precise cuts – even with hard, brittle, or delicate materials. - Small footprint with maximum stability
Its compact design (just 790 mm x 790 mm) and highly rigid machine structure result in minimal vibrations, significantly enhancing cut precision and reliability. - Simple and intuitive operation
The AD20T features a 17-inch touchscreen and modern graphical user interface (GUI). The user-friendly control system is based on ACCRETECH’s proven AD/SS series interface, allowing quick recipe adjustments and easy process management.
Applications
- Ideal for silicon wafers up to 200 mm diameter
- Well-suited for hard and brittle materials (e.g., glass, ceramics) and electronic components
- Perfect for applications requiring high precision and minimal material loss
Technical Specifications
- Max. wafer size: Φ200 mm
- Spindle power: 1.8 kW
- Max. spindle speed: 60,000 rpm
- X-axis feed range: 0.1 – 400 mm/s
- Dimensions (W x D x H): 790 mm x 790 mm x 1,900 mm
- Weight: 1,100 kg
Contact us today to find out how the AD20T can significantly improve your manufacturing process!
Explore Our Full Product Line
Download the product overview to see how our solutions can support your needs.
Find the right blades for you:
Ensure maximum performance, precision and process reliability – precisely tailored to your application.
Resin Bond Dicing Blade for glass and ceramics →
Resin Bond Dicing Blade for QFN and DFN packages →
Metal Bond Dicing Blade for glass and quartz →
Metal Bond Dicing Blade for modern electronics processing →
Metal Bond Dicing Blade for high-performance ceramics →
Ultra-hard Metal Dicing Blade for non-ferrous metals →
Hub Dicing Blade for silicium →
Nickel Bond Dicing Blade for wafer and substrates →
Nickel Bond Dicing Blade for ceramics →
Nickel Bond Dicing Blade for raw ceramics and hard materials →
Maximum performance with the right machine accessories:
Find efficient water treatment and cleaning solutions for your dicer process.
WR30X PLUS: Efficient Water Treatment for Wafer Dicing →
TD2A-3S / TD1A-S: CO₂ Add-On System for Wafer Dicing →
P102E: Additive Dispensing system for Wafer Dicing →
P103: Additive Dispensing with Diaphragm Pump Technology for Wafer Dicing →
A-CS-300: Automatic Cleaning System for Wafer Dicing →
