Semiconductor Manufacturing Solutions – Precision by ACCRETECH

Whether silicon, GaN, or sapphire: ACCRETECH supports your wafers from edge grinding to dicing. With high-tech systems for grinding, polishing, dicing, CMP, and probing – modular, fast, and compact.

Our Technologies Along the Process Chain

Wafer Edge Grinding

Clean Edges from the Start
With our flexible edge grinders (2–12”), you shape wafer edges reliably, material-specifically, and with minimal yield loss. Ideal for silicon, sapphire, and more.

High Rigid Grinding

For the Hardest Materials
Silicon carbide, sapphire, GaN? No problem. Our high-rigidity grinders provide maximum stability and precision for the most demanding substrates.

Learn more about Edge Grinding

Learn more about High Rigid Grinding

Perfectly Planar Surfaces for Optimal Structures
Chemical Mechanical Planarization (CMP) ensures planar surfaces on multilayer wafers. Our CMP systems are robust, precise, and ready for any lithography step.

Wafer Probing

Early Defect Detection, Faster Progress
With our fully automated probers, you can thoroughly analyze wafers — quickly, accurately, with intelligent wafer handling and high throughput.

Learn more about CMP

Learn more about Wafer Probing

Polish Grinding

Thinner, Finer, Smoother
Our polish grinders combine thinning and stress relief in one step – ideal for ultra-thin wafers and backside defect-free surfaces.

Wafer Dicing

Precision Die Separation
Whether blade or laser dicing: our dicers ensure minimal edge damage with maximum process speed – now also with ML technology.

Learn more about Polish Grinding

Learn more about Wafer Dicing

ACCRETECH – Your Full-Liner for Semiconductor Manufacturing

From front-end wafer preparation and testing to back-end die singulation: ACCRETECH delivers complete solutions for every stage of semiconductor manufacturing – optionally with pick & place automation for high volumes.