Precise Wafer Edge Grinding for Wafers up to 200 mm
W-GM-4200
The W-GM-4200 stands out with the highest grinding precision and a compact design – perfectly suited to the demands of modern wafer production. Our newly developed grinding unit ensures exceptional rotational accuracy and sharp edge profiles, offering optimal protection for even the most sensitive wafer materials such as GaAs, SiC, or GaN.
With contactless measurement technology, the machine reliably measures wafer thickness, diameter, and notch depth before and after the grinding process, ensuring consistently high quality. The innovative mirror-finish technology minimizes grinding damage and sustainably improves surface quality.
Your Benefits at a Glance:
- Precise grinding for the highest product quality
- Compact design for space-saving integration
- Easy operation for efficient production workflow
- Versatile use for various wafer materials
Take the next step to flawless wafers with the W-GM-4200 – contact us for personalized consultation and tailored offers!
